KIC‘s MB (Marybeth) Allen to Participate in South African Seminar

(San Diego, CA -- September 10, 2007) : San Diego — September 10, 2007 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that MB Allen, General Manager of KIC International Sales Inc. — European Operations, will participate in a SMART Group SA-sponsored seminar in South Africa.

The seminar, Design for Cost Effective Assembly, will take place twice — 29 October 2007 at the Protea Hotel in Stellenbosch, and 31 October 2007 at the Protea Hotel in Midrand, South Africa.

Design for manufacture (DFM) and the value of effective new product introduction (NPI) guidelines must be considered if you are producing your own products or subcontracting the assembly. Design review at the layout stage can save money and produce a better, lower cost product. Design engineers, NPI engineers, process engineers, all levels of management and anyone who interfaces between design and manufacture or with customers or suppliers will benefit from attending this seminar.

MB Allen and the other speakers from Europe will provide a better understanding of the errors in design that add cost to the final product and the effect lead-free has on printed board design, specification and procurement. Component specification and testing requirements to meet WEEE and RoHS will be discussed along with the simple guidance on ranking circuit board solder finishes.

Layout changes that lead to cost effective assembly will be highlighted as well as other changes to improve yields on existing designs. Design modifications that have been used to reduce or eliminate fillet lifting, pad lifting will be illustrated and their apparent success or failure. Even if you are running a tin/lead process and do not intend to change your process these recommendations can improve your existing manufacturing processes. Each delegate will receive a copy of presentation material plus supporting document relating to lead-free processes and design issues.

The seminar will cover component specification, selection and WEEE & RoHS compatible; PCB laminate changes, options and industry trends; using realistic manufacturing tolerances to reduce costs; PCB design for manufacture review check list; through-hole pad sizes & fillet lifting issues; PCB supports for wave and reflow; via hole plating and reliability with lead-free processes; copper thickness and lead-free copper erosion issues; solder finish selection, PCB storage life and process compatibility and more.

To book a place or for more information, e-mail info@smartgroupsa.org or visit www.smartgroupsa.org.

KIC -- Headquarter Office
15950 Bernardo Center Dr #E
San Diego, CA  92127
Tel: +1(858)673-6050
Fax: +1(858)673-0085

Company Contact:   Bjorn Dahle <bjorn@kicmail.com>
Editorial Contact: Allene Bailey <allene@kicmail.com>