SlimKIC 2000 Lead Free Capable

Profiling So Easy, Anyone Can Do It

SlimKIC 2000 Photo

By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select from a built-in library containing hundreds of commonly used solder paste specifications, and the software automatically defines the process window. Oven zones and mapping of thermocouples on the product are automated using innovative, patent pending technology.

The SlimKIC 2000 simplifies profiling by reducing the process to a single number -- the Process Window Index™ (PWI) -- so you know precisely how good your profile is. The simplified user interface guides the operator through the profiling process, minimizing the potential for improper oven set up and yield-reducing defects.

The Process Window Index

PWI Bullseye

Profiling Reduced to a Single Number
For precise ranking of profile performance, the KIC software uses the Process Window Index (PWI). The PWI measures the profile’s fit to the process window in a mathematical and objective manner by using a single number. This aids in optimizing the process by comparing and ranking alternative profiles in terms of their fit to the available process window. The lower the PWI, the more efficient and stable the process! (See the PWI data sheet for a detailed explanation)

Technical Specifications

Accuracy: ±1.2C
Resolution: Variable 0.3C to 0.1C
Internal Operating Temp: 0C to 105C
Thermocouple Compatibility: Type K, 9 or 12 channels
Temperature Range: -150C to 1050C
Power Requirements: Standard 9V alkaline battery
Thermal Receiver: 433.92 MHz (Dual Unit Model only)
Dimensions: See Temperature Tolerance Chart below for specifications

Datalogger Model: data is downloaded to the computer through a cable after the run.
Dual Unit Model: data is sent to the computer in real-time during the run. It is also stored internally for high-speed download after the run.

Temperature Tolerance Chart (maximum endurance in minutes at specified temperature)
 CONFIGURATION DIMENSIONS (mm)
(Length x Width x Height)
150C 200C 250C 300C 350C 400C
 SlimKIC 2000, 9CH no shield 260.4 x 76.2 x 19.9 8.5 5.5 4.2 3.5    
 SlimKIC 2000, 12CH no shield 260.4 x 101.6 x 19.9 8.5 5.5 4.2 3.5    
 LowRider cover 260.4 x 76.2 x 19.9 13.9 8.3 5.5 4.7    
 Thermal Shield 1/8” (3.2mm), 9CH 323.9 x 86.4 x 26.4 17.6 11.0 8.0 6.4    
 Thermal Shield 1/8” (3.2mm), 12CH 323.9 x 108.0 x 26.4 17.6 11.0 8.0 6.4    
 LowRider and Thermal Shield 1/8” (3.2mm) 323.9 x 86.4 x 26.4 22.6 15.1 10.7 8.7    
 Thermal Shield 1/4” (6.4mm), 9CH 330.2 x 95.3 x 34.3 24.6 15.5 11.5 9.8    
 Thermal Shield 1/4” (6.4mm), 12CH 330.2 x 115.6 x 34.3 24.6 15.5 11.5 9.8    
 LowRider and Thermal Shield 1/4” (6.4mm) 330.2 x 95.3 x 34.3 30.7 22.6 16.4 12.2    
 Long Duration Thermal Shield 381.0 x 139.7 x 76.2 62.8 42.2 33.1 29.7    
 Lead-Free Thermal Shield, 9CH 343.9 x 88.9 x 25.4 18.6 12.7 10.7 9.1 7.9 7.6
 Lead-Free Thermal Shield, 12CH 343.9 x 109.9 x 25.4 18.6 12.7 10.7 9.1 7.9 7.6

Computer Configuation

Minimum System Requirements

KIC ON BOARD

Copyright © KIC. All rights reserved. Patents pending. Specifications subject to change without notice.


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